Solder Joint Coating Thickness Measurement System

Business Type Manufacturer, Exporter, Supplier, Retailer, Wholesaler, Importer
CE approval EN 61010
X-Ray standards DIN ISO 3497 and ASTM B 568
Approval Fully protected instrument with type approval according to the German regulations
Click to view more

Preferred Buyer From

Location Anywhere in India

Product Details

Interior dimensions of chamber
Width x depth x height: 580 x 560 x 145 mm (22.8 x 22 x 5.7 in)
Weight
Approx. 135 kg (297 lb)
External dimensions
Width x depth x height [mm]: 660 x 835 x 720 mm (26 x 33 x 28.3 in)

Coating thickness gauge for electroplating and electroless coatings XDV-µ or X-Ray Fluorescence Tester is available in various technical specifications. These are widely used for non-destructive analyses and measurements of coating thickness on very small components and structures, even with complex coating systems.

Applications

  • Measurements on very small flat components and structures such as printed circuit boards, contacts or lead frames
  • Analysis of very thin coatings, e.g., gold/palladium coatings of ≤ 0.1 μm (0.004 mils)
  • Measurement of functional coatings in the electronics and semiconductor industries
  • Determination of complex multi-coating systems
  • Automated measurements, e.g., in quality control

Yes! I am interested

Looking for "Solder Joint Coating Thickness Measurement System" ?


Raise your Query

Hi! Simply click below and type your query.

Our experts will reply you very soon.

WhatsApp Us