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Solder Joint Coating Thickness Measurement System

Home › Products › Coating Thickness Measurement System › Solder Joint Coating Thickness Measurement System

Solder Joint Coating Thickness Measurement System
Solder Joint Coating Thickness Measurement System
Business Type Manufacturer, Exporter, Supplier, Retailer, Wholesaler, Importer
CE approval EN 61010
X-Ray standards DIN ISO 3497 and ASTM B 568
Approval Fully protected instrument with type approval according to the German regulations
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Preferred Buyer From

Location Anywhere in India
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Product Details

Interior dimensions of chamber
Width x depth x height: 580 x 560 x 145 mm (22.8 x 22 x 5.7 in)
Weight
Approx. 135 kg (297 lb)
External dimensions
Width x depth x height [mm]: 660 x 835 x 720 mm (26 x 33 x 28.3 in)

Coating thickness gauge for electroplating and electroless coatings XDV-µ or X-Ray Fluorescence Tester is available in various technical specifications. These are widely used for non-destructive analyses and measurements of coating thickness on very small components and structures, even with complex coating systems.

Applications

  • Measurements on very small flat components and structures such as printed circuit boards, contacts or lead frames
  • Analysis of very thin coatings, e.g., gold/palladium coatings of ≤ 0.1 μm (0.004 mils)
  • Measurement of functional coatings in the electronics and semiconductor industries
  • Determination of complex multi-coating systems
  • Automated measurements, e.g., in quality control

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