Wafer & Lead Frame Coating Thickness Measurement System

The range of Lead Frame Coating is uniquely designed with high-precision, programmable XY-stage as well as an electrically.

The user-friendly bench-top instruments are acclaimed for sample stage moves into the loading position automatically in case the protective hood is opened.

These are solid and strong range that ensure longer stability. With laser pointer works as a positioning help and support the rapid alignment of the sample to be measured.

These are carefully operated through the dominant and user-friendly WinFTM® software designed as per German regulations Deutsche R ntgenverordnung-rov". Its whole operation as well as evaluation of measurements and the clear arrangement of measurement data is performed on a PC through software.

Typical areas of application are

• Study of very thin coatings of 0.1 m (0.004 mils)
• Measurements of practical coatings in the electronics as well as semiconductor industries
• Determination of complex multi-coating systems and lead content in solder
• Automated measurements such as quality control

General Specification

• Intended use:Energy dispersive X-ray fluorescence measuring instrument (EDXRF) to determine thin coatings and alloys
• Element range:Aluminum Al (13) to Uranium U (92) - up to 24 elements simultaneously
• Design:Bench-top unit with hood opening upwards XY-stage and Z-axis electrically driven and programmable,Motor-driven changeable apertures and filters Video camera and laser pointer (class 1) for orienting the sample
• Measuring direction:Top down

Lead Frame Coating Thickness Measurement gauge for electroplating as well as electroless coatings X-Ray or XDV-µ Fluorescence Tester is accessible in diverse technical specifications. The range of o Lead Frame Coating is used for non-destructive analyses as well as measurements of coating thickness on very tiny components and structures with complex coating systems.

Applications

• Measurements on very tiny flat components as well as structures like contacts, printed circuit boards, or lead frames
• Study of very thin coatings like gold/palladium coatings of 0.1m (0.004 mils)
• Measurement of functional coatings in the semiconductor and electronics industries
• Determination of complex multi-coating systems
• Automated measurements like quality control

General Specification

• Intended use:Energy dispersive x-ray fluorescence measuring instrument (EDXRF) to measure thin coatings and coating systems on very small flat structures.
• Element range:Aluminum Al (13) to Uranium U (92) - up to 24 elements simultaneously.
• Design:Bench-top unit with hood opening upwards and housing with a slot on the side.
• X/Y- and Z-axis electrically driven and programmable
• Motor-driven changeable filters
• Measuring direction:Top down

Wafer coating thickness instrument is one of the most favored device of the market due to accurate designs and exceptional accuracy. Our range of Wafer Coating Thickness is high in performance with modern vacuum chamber for non-destructive coating thickness measurements and material examination. Designed as per international industrial standards, our offered devices are used for non-destructive study of thin coatings, light and traces elements. Up to 24 elements of sodium (11) to uranium (92) range can be easily determined at the same time. Ergonomically designed, they are used in vacuum, ambient air or using helium purge (optional).

Applications

• Examination of very thin coatings of  0.1m (0.004 mils)
• Measurements of functional coatings in the semiconductor as well as electronics industries
• Study of complex multi-coating systems and lead content in solder
• Automated measurements