XDV-U Wafer & Lead Frame Coating Thickness Measurement System

XDV-U Wafer & Lead Frame Coating Thickness Measurement System
Business Type Manufacturer, Exporter, Supplier, Retailer, Wholesaler, Importer
Dimension 403 x 588 x 444 mm
Testing Methodology Radiographic Testing
Brand Fischer
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Preferred Buyer From

Location Anywhere in India

Product Details

Service Type
Thickness Measurement
Value Data Report on
Mechanical Engineering

Lead Frame Coating Thickness Measurement gauge for electroplating as well as electroless coatings X-Ray or XDV-µ Fluorescence Tester is accessible in diverse technical specifications. The range of o Lead Frame Coating is used for non-destructive analyses as well as measurements of coating thickness on very tiny components and structures with complex coating systems.


  • Measurements on very tiny flat components as well as structures like contacts, printed circuit boards, or lead frames
  • Study of very thin coatings like gold/palladium coatings of 0.1m (0.004 mils)
  • Measurement of functional coatings in the semiconductor and electronics industries
  • Determination of complex multi-coating systems
  • Automated measurements like quality control

General Specification

  • Intended use:Energy dispersive x-ray fluorescence measuring instrument (EDXRF) to measure thin coatings and coating systems on very small flat structures.
  • Element range:Aluminum Al (13) to Uranium U (92) - up to 24 elements simultaneously.
  • Design:Bench-top unit with hood opening upwards and housing with a slot on the side.
  • X/Y- and Z-axis electrically driven and programmable
  • Motor-driven changeable filters
  • Measuring direction:Top down

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